Integrated circuit package and medical device including same

Various embodiments of an integrated circuit package are disclosed. The package includes an integrated circuit having an integrated circuit contact disposed on a first major surface of the integrated circuit; a first passivation layer disposed on the first major surface of the integrated circuit and over the integrated circuit contact; and a redistribution layer disposed on the first passivation layer. The redistribution layer includes a conductive trace and a shield region that define a plane of the redistribution layer. The package further includes a second passivation layer disposed on the redistribution layer, and a patterned conductive layer disposed on the second passivation layer and including a conductive trace. A portion of the shield region of the redistribution layer is disposed between the conductive trace of the patterned conductive layer and the integrated circuit along an axis that is substantially orthogonal to the first major surface of the integrated circuit.

The abstract as published by the patent office, from US2023420383A1. It describes the invention; it is not a statement of what is protected.

• Interface and electrodes

  Electrodes and arrays

• Implant electronics

  Chips and on-implant computing

• Packaging

  Packaging and hermeticity

• Stimulation

  Stimulation

What the filing appears to be about, read by published rules from its title, abstract and classification codes (A61N1/0504, A61N1/0509, A61N1/0531, A61N1/0534, A61N1/0541). The claims define what a patent protects, and they are not read here.

Interface and electrodes

Everything downstream works with what the contacts pick up. Their number, size and distance from the neurons set the ceiling on the signal. The problem behind it: more contacts, closer to neurons, that still record after years in tissue that reacts to them.

Implant electronics

An implant has room for very little, so functions that fill a rack in the laboratory have to fit on a chip. The problem behind it: fitting channel count, computing and safety functions into a volume and a heat budget the body accepts.

Packaging

Body fluid destroys unprotected electronics. An implant meant to last has to stay sealed for years while passing every channel through its wall. The problem behind it: a seal that lasts as long as the patient needs it, at a size that leaves room for the channels.

Why the layer matters to the field, not a judgement of this filing. A patent family shows that protection was sought. It does not show that the technology was built, is used in a product, or works in people. The whole stack

One invention, published 5 times in 4 offices. Each publication opens in Espacenet.

• United StatesUS2023420383A128 Dec 2023US12707980B211 Aug 2026 · grant
• International (PCT)a route to several countries, not a countryWO2023248083A128 Dec 2023
• ChinaCN119318019A14 Jan 2025
• European Patent Officea route to several countries, not a countryEP4544591A130 Apr 2025

1. 22 Jun 2022First filingEarliest priority, at United States. The family is counted in this year.
2. 7 Sep 2022Owner recordedUnited States, on US2023420383A1: assignment; owner named: MEDTRONIC, INC., MINNESOTA.
3. 16 Jun 2023ApplicationsFiled at International (PCT), China, European Patent Office.
4. 28 Dec 2023First publicationUS2023420383A1, United States.
5. 11 Aug 2026Grant publishedUS12707980B2, United States.

Dates as the offices published them. Office records are in the offices' own words and are a selection: refusals, lapses and withdrawals, and records that name an owner. Each concerns one member of the family, not the family as a whole, and another member in the same office may stand. Whether a patent is in force today is not assessed.

Organisation

Medtronic · 40 families identified

• Bibliographic data, family members and office records: European Patent Office, Open Patent Services (the DOCDB and INPADOC databases), read 7 Oct 2026.
• The record itself, with its claims and description: US2023420383A1 in Espacenet
• Counted as a BCI patent family: classified A61N1/0531 (brain cortex electrodes); filed by Medtronic, Inc., an organisation already in the graph; cites a family already accepted. How families are found and judged